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● Product Description ●

TS9000 series injection valve

The TS9000 series spray valve is a non-contact spray dispensing valve that can be widely used for controllable flow and high-speed dispensing operations of various adhesives such as surface mount adhesives, conductive silver paste, IC packaging adhesives, bottom filling adhesives, sealants, surface coating adhesives, etc.

Using piezoelectric technology, TS9000 ensures excellent dispensing accuracy and process control while providing efficient production efficiency. The non-contact spray dispensing method eliminates Z-axis movement to achieve higher production efficiency and avoids needle collisions with workpieces, thereby improving the yield rate.

The Techcon Systems TS9000 series jet valve has a compact structure and modular design, and is easier to install on dispensing platforms when paired with the jet valve controller TS900. Corresponding to different dispensing volume requirements, a variety of nozzles are available for selection.

Typical applications:

Suitable for adhesive applications such as solder paste spraying, MEMS (Micro Mechanical Electronic Systems) packaging, UV materials for precision assembly, bottom filling, wafer bonding, conductive silver paste, patch red glue, hard disk assembly, etc. in the electronic packaging industry, lighting LED industry, energy industry, life medicine and other industries.

TS9000 series dispensing valve features:

1. Non contact spray dispensing eliminates Z-axis movement to achieve higher production efficiency
2. High precision dispensing
3. Efficiently maintain consistency in the amount of glue sprayed, with a minimum glue size of 0.002 liters (2nl)
4. The spraying speed can reach 300 times per second
5. Applicable fluid viscosity range is 7000 to 2000000 Cps
6. Exquisite modular design
7. Convenient and fast cleaning
8. Quickly replace components on site to improve production line efficiency
9. High cost-effectiveness

TS9000 series dispensing valve specifications: